报告人：Dr. Jiangqi He (Huawei)
时间: 10:15 am-11:15 am, Feb. 20, 2017
地点: 物理机电航空大楼438会议室
摘要: Future client devices, datacenters and communication systems require higher speed, higher power and higher density hardware designs. Those requirements are pushing the limit of engineering design and analysis capabilities. Among them, system interconnect becomes the most critical, which includes high speed channel, power delivery network, voltage regulator efficiency and system level RFI/EMI/EMC. This presentation will illustrate some of the technical challenges and industry trends in different areas such as electrical, thermal, material, analysis tool and methods. Electromagnetics associated challenges and design practices will be focused.
报告人简介: Dr. Jiangqi He joined Huawei as a chief architect in Central Hardware Engineering Institute at the beginning of 2017. Before that, He was an Intel principal engineer at Datacenter Engineering Division, Intel Datacenter Group. He obtained his BS in physics from Xiamen University, MS in ECE from NMSU and PhD in ECE from Duke University, 1992, 1997 and 2000 respectively. Dr. He joined Intel right after school and he has been worked on packaging technology, power integrity, signal integrity, and system level electrical design for many CPUs and platforms. He held multiple leadership and management roles for over 16 years at Intel which includes his recent leadership about the front end development for Intel’s first FIVR (Fully Integrated Voltage Regulator) on server CPU products (Haswell). He has published more than 50 peer reviewed papers on his technical field and some of them were honored as best papers. He also obtained more than 80 USA and international patents. He is an IEEE senior member and has served as a technical reviewer, committee member and organizer for multiple journals and conferences. His current interests are on small form factor integrated power devices, platform and rack level power architecture, and system level electrical optimizations. He is also interested and heavily engaged in tool and methodology development associated with electromagnetics, thermal and electrical circuits.
