研究方向：
计算电磁学、高速集成电路SI/PI，EMI/EMC。
教育经历：
2019.10-2020.10，美国杜克大学，博士联合培养项目
2016.09-2020.12，厦门大学，电磁场与微波技术，博士
2013.09-2016.09，电子科技大学，机械工程，硕士
2009.09-2013.09，电子科技大学，工业工程，学士
工作经历：
2023.03–今 厦门大学，电子科学与技术学院，助理教授
2021.04–2023.01 厦门大学，电子科学与技术学院，博士后
联系方式：
电子邮箱：kechen@xmu.edu.cn
办公地点：厦门大学海韵园校区物理机电大楼431
科研项目:
国家自然科学青年基金，芯片-封装-PCB电磁联合仿真快速算法的研究及应用，2022/01-2024/12，在研，主持。
代表作：
[1] K. Chen, J. Chen, X. Hou, M. Zhuang, Q. H. Liu. Broadband S-Parameter Simulation Based on the Mixed Finite-Element Method and Symmetric Lanczos Algorithm[J], IEEE Access, 2023. DOI: 10.1109/ACCESS.2023.3236813.
[2] S. J. Wang, J. Liu, K. Chen*, Q. H. Liu*. A spurious-free domain decomposition method for 3-D Maxwell’s eigenvalue problems[J]. IEEE Transactions on Microwave Theory and Techniques, 2023. 71(2): 548-560.
[3] K. Chen, X. Hou, M. Zhuang, N. Liu, Q. H. Liu. An efficient mixed finite-element time-domain method for complex electrically small problems. IEEE Transactions on Microwave Theory and Techniques, 2019. 67(4):1285-1294.
[4] K. Chen, J. Liu, M. Zhuang, Q. Sun, Q. H. Liu. New mixed SETD and FETD methods to overcome the low-frequency breakdown problems by tree-cotree splitting. IEEE Transactions on Microwave Theory and Techniques. 2020. 68(8): 3219-3228.
[5] K. Chen, M. Zhuang, J. Liu, M. Yuan, Q. H. Liu. A combination of mixed FETD method and SPICE to simulate nonlinear multiport circuits. IEEE Microwave and Wireless Components Letters. 2021. 31(2): 97-100.
[6] K. Chen, M. Zhuang, X. Hou, N. Liu, Q. H. Liu. The mixed finite-element time domain method for overcoming low –frequency breakdown. URSI Asia-Pacific Radio Science Confer. 2019.
[7] R. Hong, K. Chen, X. Hou, Q. Sun, N. Liu, Q. H. Liu. Mixed finite element method for full-wave simulation of bioelectromagnetism from DC to microwave frequencies. IEEE Transaction Biomedical Engine. 2020. 67(10): 2765-2772.
[8] X. Lu, K. Chen, L. Xiao, X. Wang, Q. H. Liu. Wideband low-frequency design of inductors and wireless power transfer coils using the mixed finite-element time-domain method. IEEE Microwave and Wireless Components Letters. 2020. 30(7): 709-712.
